Al2O3 - Sapphire Wafer 10x5x0.5 mm , A plane (11-20), 1 SP Binder For calculating the actual pressure

For calculating the actual pressure (Mpa) applied to your working piece

Hardness: 9 ( mohs)

alumina cutting blade provides better cutting rate to cut metallic material at much lower cost

or 500 MPa equivalent

75" ID and 1" OD) installed

Al2O3 - Sapphire Wafer 10x5x0.5 mm , A plane (11-20), 1 SP Binder For calculating the actual pressureFeatures: Sapphire substrate is the popular substrates for III V nitrides, superconductor and magnetic epi film due to less mis matched lattice and stable chemical and physical properties. Wafer size: 10 mm x 5 mm x 0. 5 mm thick Orientation tolerance: + 0. 5 Deg. A plane orientation Polished surface: One side EPI polished via a special CMP procedure with Ra < 5 A Package: Each wafer is packed in 1000 class clean room with 100 grade plastic bag with