GaP Wafer, Undoped (111) 10x10x0.5 mm, 2sp Pouch Cell It is important to bury

It is important to bury the tungsten coil to prevent heat dissipation

made of 316 stainless steel with sealing O-ring

we will forward your inquiry to the manufacturer

Sepecification: Apperance: White powder Viscosity: 200300mpa

Carrier Concentration: (3

GaP Wafer, Undoped (111) 10x10x0.5 mm, 2sp Pouch Cell It is important to buryGaP single crystal wafer, Size: 10mm x 10 mm x 0. 5 mm, Doping: undoped, Conducting type: N type, Orientation: (111) Polished: Two sides Surface finish (RMS or Ra) : < 8A Typical Physical Properties Crystal Structure Cubic. a =5. 4505 Growth Method CZ (LEC) Density 4. 13 g cm3 Melt Point 1480 oC Thermal Expansion 5. 3 x10 6 oC Dopant S doped undoped Crystal growth axis <111> or <100> <100> or <111> Conducting Type N N Carrier Concentration 2 ~ 8 x1017