Thermal Oxide Wafer: 300 nm SiO2 Layer on Si (100), 4"dia x 0.50 mm t, N type, P-doped , 1SP R:1-10 ohm.cm Sodium-ion Battery Supplies Please use Ar gas for

Please use Ar gas for glovebox operation

Includes easy to use and powerful software that allows you to graphically design your battery analysis routines and can simultaneously control over 100 UBA5s from one PC

Inside Diameter

General Properties  for Gold

2-3/8" OD Alumina tube ( 95% Al2O3 material)

Thermal Oxide Wafer: 300 nm SiO2 Layer on Si (100), 4"dia x 0.50 mm t, N type, P-doped , 1SP R:1-10 ohm.cm Sodium-ion Battery Supplies Please use Ar gas forThermal oxide Layer Research Grade , about 80 % useful area SiO2 layer on 4" Silicon wafer Oxide layer thickness: 300 nm (3000A) + 10% Growth method Dry oxidizing at 1000oC Refractive index 1. 455 Silicon Wafer Specifications: Conductive type: N Type P doped Resistivity: 1 10 ohm. cm Size: 4" + 0. 5 mm x 0. 5 mm Orientation: (100) + 1o Polish: one side polished Surface roughness: < 5A Optional: you may need tool below to handle the wafer ( click