MS00100 - SEMI MS1 - Guide to Specifying Wafer-Wafer Bonding Alignment Targets Revision:SEMI MS1-0307 (Reapproved 0318) - Superseded The formats for data produced

The formats for data produced as a result of executing a data collection plan are also defined

SEMI 3D17-1217 (first published)

except that it uses special wafer holding fixtures to orient the wafer uniquely with respect to the X-ray goniometer

SEMI G4-89 (technical revision)

It should be noted that the following list of criteria was considered when determining the specified analytical method

MS00100 - SEMI MS1 - Guide to Specifying Wafer-Wafer Bonding Alignment Targets Revision:SEMI MS1-0307 (Reapproved 0318) - Superseded The formats for data produced1 Purpose 1. 1 This Guide provides a framework for specifying the dimensions, location, quantity and characteristics of alignment targets that are placed on each wafer of a pair of wafers. Such targets are used to align two patterned wafers prior to an operation that bonds them together. 2 Scope 2. 1 This Guide applies to targets that can be used with two common alignment processesinner surface alignment and outer surface alignment. 2. 2 This Guide