M07300 - SEMI M73 - Test Method for Extracting Relevant Characteristics from Measured Wafer Edge Profiles StdTpc-Automated Material Handling Systems

M07300 - SEMI M73 - Test Method for Extracting Relevant Characteristics from Measured Wafer Edge Profiles StdTpc-Automated Material Handling Systems1 Purpose 1. 1 SEMI M1 specifies the contour of the shaped edge of silicon wafers by using templates that allow a wide variation in wafer edge profiles manufactured by silicon suppliers to still meet the specification. 1. 2 In many advanced wafer applications, a much tighter specification of the edge profile is required to control variations in subsequent circuit processing. These specifications frequently include values for certain characteristics

SEMI G92-0315 (technical revision)

FPD製造において利用される

SEMI E88-0307 (Reapproved 0318)

The scope of this Specification is for one grade of n-butyl acetate used in the semiconductor industry

support equipment

The VLSI grade purity level is typically required by semiconductor devices with geometries of 0

SEMI M31-0699 (technical revision)

SEMI C61-0707 (Withdrawn 0114)

This Standard applies to components that are installed in between a substrate and a component in a sandwich or stacked manner

2  Knowledge of these characteristics can help the producer and consumer determine if the dimensional characteristics of a specimen wafer satisfy given geometrical requirements

the locations of the reference points that separate the various segments of the edge profile are determined

SEMI M31-0306 (technical revision)