3D02200 - SEMI 3D22 - Guide on Measurements of Openings and Vias in Glass StdTpc-Documentation/Training UL Solutions eLearning courses are

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本文書は，サプライヤまたはユーザが採用する危険源評価方法，または危険制御戦略（例えば，設計原理）に制限を加えることは意図しない。十分なレベルの保護が得られるなら，他のさまざまな方法を採用してもよい。

注意：本安全基準中以「註」為標題的段落並非正式內容，不得以此修改或取代正式的安全基準。

This Document applies only to substrate map data items

The test methods for the individual properties have been given in this Standard

3D02200 - SEMI 3D22 - Guide on Measurements of Openings and Vias in Glass StdTpc-Documentation/Training UL Solutions eLearning courses are1 Purpose 1. 1 Through glass vias is an emerging technology in the semiconductor industry. Definitions for openings in glass have been described in SEMI 3D11, and a specification for glass as substrate for semiconductor applications with or without openings has been laid out in SEMI 3D16. However, there are few or no agreed upon test methods for measuring the physical and dimensional properties of through glass vias or other openings in glass or the